Career Profile
Over a decade’s experience in firmware development and its mobile applications of human interface. Constructed 1st touch and display driver integration (TDDI) solution and prototyped smallest optical image stabilization (O.I.S) camera for smartphone. Proven track record of superior on-site ODM support over 30% of the DSC market, shipping into almost every camera brand.
Experiences
Provided fast and stable AI inspection solution
Worked on developing Touch&Display driver integration(TDDI) from 0 to 100Mu shipments in 3yrs with exceptional cross-geography teamwork.
- Led 1st TDDI XL display ASIC to MP with A0 silicon for 9 customers.
- Led 1st TDDI Gen2 ASIC to MP, 3 months ahead of original target.
- Constructed TDDI Gen1 for world’s first TDDI single-chip solution.
- Implemented an auto-notify FW build validation of continuous integration(CI). Focused on cloud-based automated regression testing.
Led and supported in 10+ ODM projects from design-in to massproduction, accounting for millions of shipped cameras. And brought up SoCs drivers (CMOS sensor, LCD, Audio Codec…) connecting through common interface (LVDS, I2C, SPI, UART…) and debugging and developing features in image signal processing pipeline&software flow.
In one year, built the smallest 2-axes anti-shake O.I.S system for mobile phone camera in collaboration with Japanese engineering colleagues, and implemented camera module system with H.264 video recording in WinCE platform.
Certifications
“Exhilarating and Rewarding Environment” for achievement for initial release to MP of tire-one OEM with A0 silicon.
“Innovation to Win” for overcoming a tremendous deal of challenges throughout silicon development w/ new fabrication.